Expert in the modeling tools for the next generation thermal , thermomechanical and reliability issues (specifically dealing with Self Heat, Electromigration and di-electric failure) especially in the semiconductor and electronic industry and other industries in general
Led the modeling of Sort Probe Reliability by doing 3D FEM static and fatigue analysis, which guided experimental approach for determining an optimized solution for SPB such that the new probes met the contact resistance requirements with an improved lifetime.
Critical team member and developer of thermal reliability software suite at a big semiconductor company to deliver a comprehensive 3D FEM based thermal reliability analysis of bump-solder-die-package-interconnects for the next generation products.
Supported RSM based temperature offset prediction tools for rapid thermal processing furnaces
Main developer of a new 3D Electro-Migration software tool
Own two PATENTS in the semiconductor industry on thermal
Reviews For This Service