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Skills

  • 2D Design
  • 3D Design
  • 3D Modeling
  • 3D Rendering
  • Analytics
  • AutoCAD
  • Autodesk Inventor
  • CAD Modeling
  • Design
  • Drafting
  • Drawing
  • Engineering
  • Modeling
  • Mold Design
  • Product Design

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Services

  • Product Designing, CAD, FEA simulation

    $10/hr Starting at $100 Ongoing

    Dedicated Resource

    -  Product designing, 3d modeling and detailing using AutoCAD and SolidWorks -  Tooling fixture design drawing detailing.  Tooling fixtures that is used for productions -  Finite Element Analysis simulation...

    2D Design3D Design3D Modeling3D RenderingAnalytics

About

I subscribe to the belief that designs right from the start of CAD (Computer Aided Design) and FEA (Finite Element Analysis) should be Purposely Functional and Relevant to its original inten

• A graduate of Bachelor of Science in Electronics and Communications Engineering BSECE (2006), with Master in Management for Executives and Managers MMExM (2015) at University of San Jose-Recoletos Cebu, Philippines. Also, a graduate of Industrial Electronics Technology (1995) at Xavier University (Ateneo de Cagayan) Cagayan de Oro City.
• Semiconductor Packaging Designing and Development Experience (8 years &4 months):
o Experienced in semiconductor package designing and development for advanced surface mount devices. This covers Leadframe/tooling designs, Clip Designs, technical discussions with material supplier or equipment vendor, assembly development, material/equipment characterization, BOM finalization, facilitate qualification and pre-production builds, tackles quality and reliability issues to ensure smooth release of product to production.
o Extensive experience in panel type Leadframe designing of PQFN 3x3 & 5x6. Stamped & Etched Frame.
o Extensive experience in Clip designing of PQFN 3x3 & 5x6: pre-singulated, tape&Reel type, pre-molded type and panel type.
o Extensive experience in the use JEDEC Package Standard in generating tooling drawings and marketing outline.
o Packaging concept generation: 3D modeling, 2D detailing, and feasibility studies with existing equipment, assembly and materials.
• Proven record of patents related to semiconductor packaging:
o Granted USPTO patents (4): US7626249; US7737548; US7812437; US7902657
o https://patents.justia.com/inventor/jocel-p-gomez
• Project planning and cross-functional team engagement:
o Experienced in handling projects related to package development: Evaluations, Qualifications, and Pre-prod.
o Experienced in engaging across chains team of engineers for the success of project release, such as purchasing, production, process engineering (FOL&EOL), maintenance, QA, test engineering and reliability engineering.
o Experienced in planning and supervision of technicians and operators

Work Terms

40hrs/week work, short tern or long term work, payment term can be discussed in the contract