• Experience in opto-mechanical design, thermo mechanical FEA modeling, stress and heat management, process modeling, shock and vibe, material behavior simulation, and reliability evaluation.
• Experience of working as the Photonic/ASIC Components integrator, work with Photonics, High Speed ASIC, Laser design teams and CMs to specify& implement best in class optimal assembly processes for high volume manufacturing.
• Multidisciplinary experience in design of microelectronics packaging solutions and product qualification plans for New Product Introduction and Development (NPI)
• Master of Engineering in Mechanical Engineering (co-op) from the University of Ottawa (GPA – 9.2/10)
• Over 7 years of experience in using 3D modeling CAD tools and Certified Professional in Solidworks (CSWP)