Opto Mechanical Design | Optoelectronics Packaging | Consumer Electronics Product Development | Thermo Mechanical FEA | Shock and Vibe Simulation | Electro-optical assembly machine design
My work experience is in designing silicon photonics, optics, and laser packages along with their corresponding tooling and fixturing for automation and robotic assembly and tolerance stack-up analysis. I have developed different kinds of packaging technologies, and techniques for optomechanical, laser, semiconductor, silicon photonics, and electronic packages which include alignment station design, thermal management and thermo-mechanical FEA modelling, assembly process development, reliability evaluation, material behaviour modelling with respect to temperature, hermetic and non-hermetic package design, process modelling and development through FMEA, PCB layout etc. I have taken multiple products form concept stage to mass production.
Right now I am working with multiple clients throughout North America to develop products in the domain of optics, aerospace, telecom, electronics, agricultural, medical device etc.
Work Terms
I am willing to work as many number of hours required to successfully complete the projects. There is no limitation in number of working hours.
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