PCB development capabilities: - PCB Layout / Layer stack up / Placement / Routing / Signal integrity- No. of Layers: Worked on designs with no. of layers varying from 2 to 16- Designs with pins pitch of 0.5mm, 0.65mm, 0.8mm, 1mm etc.- Ball-grid arrays (BGAs, uBGAs) with pitches from 0.4 mm to 1.8 mm equipped with 8 to 1300 balls- Passive components from 0201 and Chip-on-boards (COBs)- High Speed designs involving DDR2 SDRAM, USB High speed, Gigabit Ethernet, etc.- RF Technology: WLAN & GPS ModulesLow level analog PCB designsEmbedded and LINUX development capabilities: - Development of application specific systems (hardware and software).- Development of LINUX drivers for custom peripherals (CCD sensors, Cameras, LCDs, Audio codecs ....) - Custom root file system generation (rfs based on Angstrom, Meego, Android ..) - Development of applications in wide range of different programing environments (Android, Qt ...)FPGA and DSP development capabilities: - Expertise in tel