Embedded product development

Offering Embedded Solutions & Design-in Service for designing and development of cutting-edge electronic products. 

1. Ideation and Feasibility

2. Requirements and Specification

3. System Design and Architecture

4. Detailed Design (Hardware, Software, & Mechanical)

5. Prototyping and Implementation

6. Integration, Testing, and Debugging

7. Validation and Certification

8. Manufacturing

9. Deployment and Maintenance

• Hardware Design:

  • Schematic Capture: Creating the detailed circuit diagram in a CAD tool (like Altium,Proteus,  KiCad, Eagle).

  • PCB Layout: Designing the physical Printed Circuit Board, placing components, and routing traces. This is a critical step for signal integrity, power distribution, and manufacturability.

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• Software Design:

  • Detailed module design: Defining APIs between software components.(IAR Embedded Workbench, Qt Creator,MPLAB X , Eclipse,STM32CubeIDE, Arduino IDE)

  • Data structures and algorithms: Planning how data will be stored, managed, and processed.

  • Driver development plan: Planning the low-level code that interfaces directly with the hardware peripherals.

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• Mechanical Design:

  • Enclosure Design: Designing the case, considering material, durability, waterproofing, and thermal management (heat sinks, vents).

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• Well versed in Agile project management methodologies. Completed Google Project Management Certification program.  

• Certified ISO 9001:2008 internal auditor.

• Developed smart metering products, which received Licenses and have two Patents (Both US and Indian. US Patent No. US 9,702,731 B2, Indian Patent No: 400626). 

• Successfully managed the design and development of electronic products, Developed Server side Meter Data Management Systems (MDMS) and user interface softwares resulting in Quantifiable result.

• Familiar with relevant IEC and BIS, ISO, ANSI 12.20 Standards.  implemented  quality management system that resulted in a  reduction in product defects.

•  wide range of MCU families from Microchip,TI, ST, Renesas, ARM etc.

• Experience in communication technologies and Modules  3G, 4G, 5G, NB-iot, LoRa, LPRF, PowerLine Communication (PLCC) etc.

• Experience in circuit design, PCB layout, and firmware development.

• Reduced design and development cycle time by  the implementation of new processes and procedures.