I have more 15 years of electronic designs.

I am designer of High speed applications (FPGA Based PC cards equipped with DDR2/DDR3/DDR4 memories, Gbit links, High speed clocks, PCI-E, USB2.0/3.0/3.1, High speed FPGA FPGA interfaces, etc),RF, Power.

I am rich experience in Candence (Allegro, Orcad, Lay out Plus, HDL)and Altium, Mentor graphic(Pads, Expedition)

Have worked with major jobs below: 

1/. Cisco 

- Position: Leader 

- Detail: Layers (30), Components (12000), High speed, SGMII, XAUI, XFP, SFP, Backplane SERDES, PCIe, DDRx, Back drill... 

2/. INTEL 

- Position: Leader 

- Detail: Layers (16), Components (3400), High speed 10G, QSFP, PCIe, DDR4 DIMM, Ethernet, Blind via and Buried via, Back drill... 

3/. CADENCE 

- Position: Leader 

- Detail: Layers (30), Components (8000), High speed 20G, QSFP, PCIe, DIMM, Ethernet, Back drill... 

4/. CPACKET 

- Position: Leader 

- Detail: Layers (18), Components (8500), High speed 40G, SFP, PCIe, DDRx, Ethernet, Back drill... 

5/. WESTERN DIGITAL 

- Position: Leader 

- Detail: Layers (22), Components (6000), High speed 40G, SFP, PCIe, Ethernet, Backdrill... 

6/. FACEBOOK 

- Position: Leader 

- Detail: Layers (20), Components (3500), High speed 10G, RF, SFP, PCIe, Ethernet …