I have 6 years experience as thermal simulation engineer. I help the design team optimizing the design to ensure product quality and cost reduction from prototype failure due to excessive temperature rise. I specialize on electronic components and system and provide cooling solutions. CAD software: • Spaceclaim CAE software: • Ansys Icepak Necessary Data: CAD PCB IDF or any data to determine component placement Load Profile Delivery output: Thermal map Junction temperature for ICs Requested information