Thermal Fluid Analysis \ Electronics Thermal Management
Thermal Fluid Analysis and Electronics Thermal Management Analysis Overview:
We can quickly determine the impact of fluids flowing in and around the design to ensure correct thermal performance, product quality, and safety. Thermal fluid analysis is a regular part of our design process—reducing the need for costly prototypes, eliminating rework or delays, and saving time and development costs.
Thermal fluid analysis enables analysis of conjugate heat transfer (thermal conduction in solids, convection between fluid and solid, and radiation) using computational fluid dynamics (CFD) so we can:
Detect hot spots in their designs
Reduce overheating challenges
Improve thermal isolation
Leverage thermal performance in their products
Flow Simulation calculates either the steady state or transient temperature fields due to:
Heat transfer in solids (conduction)
Free, forced, and mixed convection
Heat sources (heat generation rate, heat power, temperature)
To optimize the thermal performance of electronic components and ensure their operation, designers and engineers need to simulate both the environment and heat loads in and around components, PCBs, and complete products. We can perform complete thermal analysis and test design changes during the design phase.
PIKONA Engineers can import thermal properties from CircuitWorks™ ECAD files to SOLIDWORKS Flow Simulation, including dielectric and conductor density, specific heat, conductivity for PCBs, and volumetric heat sources from components. This capability facilitates setting up the CFD analysis for cooling simulation of electronic components to define PCBs and heat sources.
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