This service delivers complete, production-ready hardware development for complex electronic systems. It covers the entire journey from initial concept and schematic capture to a fully validated PCB design ready for manufacturing. The focus is on creating robust, reliable, and high-performance hardware that meets stringent production standards.
Core capabilities include:
Advanced PCB Architecture: Design of complex, multi-layer boards (1 to 16+ layers) including HDI (High-Density Interconnect) technologies.
High-Speed Digital Design: Specialized routing for high-speed interfaces including DDR3/4, PCIe, Ethernet, and USB, with rigorous signal and power integrity (SI/PI) analysis.
Mixed-Signal & RF Integration: Precise layout techniques to isolate and optimize sensitive analog and full radio frequency (RF) circuitry alongside digital components.
Power Delivery Network (PDN) Design: Creation of stable, low-noise power distribution systems to ensure component reliability and performance.
The final deliverable is a complete manufacturing package, ensuring a seamless handoff to fabrication and assembly partners. This includes:
Production-ready Gerber & Drill Files (RS-274X)
Comprehensive Bill of Materials (BOM) with sourced components
Assembly Drawings, Pick-and-Place, and Test Point Files
Full Schematic & Layout Design Files (Altium, Cadence, etc.)
Design for Manufacturability (DFM) and Test (DFT) Reports
The key differentiator is a rigorous, system-level approach that prioritizes design integrity, manufacturability, and long-term reliability from the very first schematic symbol.