ideate, innovate, Implement
Experienced Embedded Engineer with a demonstrated history of working in the electrical and electronic manufacturing industry. Skilled in Research and Development (R&D) of Embedded Systems & Internet of things.
Highlights of Main Skills:
ESP32(Expert-Arduino), ESP8266(expert-Arduino), Arduino, ESP-IDF(Beginner), freeRTOS, Nextion, MQTT, HTTP, Quectel 2G, 3G and 4G boards (EG95, Bg96, MC 60) etc, RS485, Modbus, Active and Passive RFID.
1. Development Boards - Arduino, NodeMCU, Particle Photon, BBC microbit, MSP430 launchpad
2. Microcontrollers - 8051, PIC, AVR & MSP430
3. Communication - UART, SPI, 2 wire I2C & 1 wire, LoRa Radios & Lora Gateways, sx1278, sx1276, RFM series.
4. Hardware - Circuit design, power electronics, PCB design, 3D design, PCB Antenna Integration.
5. Wireless - GSM SIM800, GPS NMEA, RFid, NRF24l01, Bluetooth & RF434mhz, BLE, beacons.Quectel Series 2G, 3G, 4G, NBIoT modules. SIM7000, Active and Pssive UHF RFiD,
6. Sensors - DHT11/22, DS18B20, Accelerometer ADXL335, Distance Ultrasonic HCSR04, PIR motion sensor, Hear rate Pulse sensor, MAX30102 pulse oximeter sensor, Soil moisture, Anemometer, BNO055,
7. Internet of Things - ESP8266 WiFi, LAN, GPRS, MQTT, HTTP & NodeRed, RestFul API's, ESP32, AWS IoT
8. API'S USED: Adafruit, Blynk, CloudMQTT, Azure, ubidots
9. Display: Neopixels ws2812, oled, nextion hmi
10. Mobile Application platform: Blynk, Cayenne
11. Single board linux platforms: Raspberry Pi, Orange Pi, Beagleboard.
12. Languages: embedded c,c++, Python, Java script.
13. SDKs: ESP IDF FreeRTOS
14. Cloud integration: AWS (any service), GooGle Cloud, Microsoft Azure
15. Other services - BOM management and sourcing information and Manufacturing links with trusted PCB manufacturers.
Work Terms
Open to work on project basis or hourly rate Basis.