Printed circuit board design and layout including standard, high-speed, HDI, rigid/rigid-flex/flex designs from 2 to 40 layers incorporating FR-4 and low loss PTFE and ceramaic materials for high speed applications. All designs produced in accordance with relavent safety and industry standards using GES to optimize thermal effiiciency, power and signal integrity and EMC performance. All board packages include PI/SI verifiation, part library, 3D models and all CAD, assembly, ODB++ files needed for manufacturer. Examples include sensor, control boards, device interfaces, IoT, DDR, PCIe, motor drives and RF applications.